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The Chip component does not have a 0. The other thing I've noticed is the manufactures have smaller pads with no side compared to any version of IPC, unless they are Kemet, Kemet uses IPC but no version shown. The Rectangular End Cap Side Goals need to be addresses in because Resistors only have metal Terminals on 3 sides and do not cannot have a side fillet. But Chip Capacitors have metal Terminals on 5 sides and a side fillet is a reality.

IPC is now a "Guideline" and should be used as such. Land Pattern pad size and spacing are flexible and not rigid hard core values. IPC is a standard for printed circuit board land pattern designs. The standard attempts to, well, standardize land patterns to try to discourage every PCB designer from having his or her own custom library of land patterns. IPC takes known good land patterns and combines them with accepted manufacturing tolerances to produce a land pattern that will work for most people most of the time.

Increasingly you will see references to IPC in datasheets instead of a land pattern drawing, so access to the standard is becoming more important over time. Cool, right? The calculator is somewhat tricky to use but if you click the right buttons you can get something like what is shown below click to enlarge. With this information, you can return to Eagle and create a land pattern for your device. Past copies of the standard included a Land Pattern Viewer that displayed only existing, IPC-approved surface mount land patterns.

Because the mathematical algorithms from IPCA are built into the LP Calculator, designers can build a land pattern for a corresponding surface mount part quickly and accurately. Like most trades, there are organizations that publish standards and processes that help govern and provide guidance. Electronics is no different. It can be purchased from their website by clicking on this link.

IPCB hopes to address the issues surrounding the geometrical aspect of the outline, pad size, shape, and tolerance of a surface-mounted component. Also, the standard takes into account other elements like the solder mask clearance, in-between components clearance, keep out spaces, and other factors that will affect the manufacturability and assembly of the components.

It is important that component footprints are created in accordance with the IPCB standard. The standard ensures that not only components are free from issues during assembly, but also allows inspection and repair to be carried out smoothly. There are a few ways to go about creating IPCB compliance component footprints.

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